39-ICH08_ASEC膠水 衡鵬供應(yīng)

ASEC 39-ICH08_underfill use for low temperature solder Package.This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.

39-ICH08_ASEC膠水特長：

Liquid state

Property    Typical Value   Test Condition

Chemical    Epoxy (Black)

Specific Gravity 1.4                @25度

Thixotropic index 1.0             12s-1/120s-1

Viscosity    4.200 mPa·s        Cone plate type, 120s-1

Cured state

Property      Typical Value   Test Condition

Tensile Modulus         4.6 Gpa               25度, DMA

Tg                 120度                 DMS

CTE α1/α2         39/105  ppm/度         TMA

Tensile shear strength 16 Mpa               JIS K 6850

Volume resistivity 2.28 x 1015Ω·cm     JIS K 6911

Surface resistivity 9.7 x 1015Ω       JIS K 6911

Dielectric constant 3.08               1.0GHz

                3.05               2.45GHz

Dielectric loss tangent 0.015               1.0GHz

                0.015               2.45GHz

39-ICH08_ASEC膠水相關(guān)產(chǎn)品：

衡鵬供應(yīng)

ASEC膠水39-ICH09